Solderability of Nickel Electrodeposits Formed under Excess Current Density.

It is known that oxides of copper, nickel, tin, etc. are reduced in hydrogen atmosphere at soldering temperature.In expectation of this hydrogen reduction effect, dull nickel electrodeposits were formed under excess current density to obtain nickel films containing hydrogen and their solderability w...

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Bibliographic Details

Published in:	Journal of The Surface Finishing Society of Japan
Main Authors:	Susumu Arai, Tadashi Takemoto, Masami Mizutani, Takashi Soya
Format:	Article
Language:	English
Published:	The Surface Finishing Society of Japan 1993
Subjects:	Electrodeposition and Electroless Coatings Electronic Packaging and Soldering Technologies Hydrogen embrittlement and corrosion behaviors in metals electrodeposited nickel solderability hydrogen content hydrogen reduction oxide reduction fcc crystal structure crystallographic texture
Online Access:	https://www.jstage.jst.go.jp/article/sfj1989/44/1/44_1_50/_pdf https://doi.org/10.4139/sfj.44.50
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